14:00 JST (APAC)
10:00 EDT, 16:00 CET (AMER and EUR)
Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and minimizing thermal stress-induced failures as well solder fatigue analysis at early phases of the system design.
This webinar will demonstrate how 3D IC designers can meet the accelerating demands for semiconductor designs requiring higher performance, lower power consumption, and efficient space utilisation.
We will address the following challenges during the webinar:
Senior Product Specialist, Altair
Iyad Rayane is a senior product specialist at Altair focusing on electronic systems design and simulation. He has 25 years of experience in the semiconductor field where he worked for different semiconductors (ST Microelectronics) and EDA companies (Mentor Graphics, Zuken). Iyad started his career in a startup in Grenoble area specialized in the Mems design and modeling.
He is author and co-author of many scientific publications in international conferences.