Learn more about PCB heat sink modelling for thermal management.
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Demand for high performance in applications like amplifiers, power converters and power electronics is driving an increased need for power consumption and high reliability in modern PCB designs. Components like voltage regulators and converters, microcontrollers and memory devices are known to heat up with more power consumption. When localized in the component junction, such heat can cause electrical functionality failure and damage to the board due to an uncontrolled increase in temperature referred to as thermal runaway. This is prevented by channeling the high heat from components and the board to the ambient using heat transfer modes such as conduction, convection and radiation. The use of PCB cooling devices such as heat sinks can be implemented to transfer the heat from component to ambient.
This white paper focuses on the thermal simulation of PCB's with and without a heat sink attachment to record the heat sink effect on a high-power dissipation component.
