Altair's electronic system design (ESD) solution represents a shift in the design and optimization of integrated circuits (ICs) and heterogeneous packages, employing a singular, integrated process centered around a 3D digital twin that expands collaboration and accelerates design. This approach is pivotal in solving complex systems' interrelated power and thermal challenges.
Join our webinar where industry expert, Iyad Rayane, will unveil Altair® SimLab®, a process-oriented multidisciplinary simulation environment used to analyze the performance of complex chip and 3D IC designs.
Additionally, SimLab improves the reliability of 3D IC designs and packages by ensuring resilience against warpage under compressive stresses, a common issue that can create significant reliability concerns in densely packed chiplet configurations. With SimLab’s proven, integrated approach, chip manufacturers can navigate the complexities of 3D IC design with greater confidence and precision – ultimately leading to more reliable and cost-effective electronic systems.
Region | Time | Language Available |
Asia | 10:30 IST | English |
13:00 China | Chinese | |
14:00 Seoul | Korean | |
14:00 Tokyo | Japanese | |
Europe | 16:00 Paris |
English |
Americas | 10:00 New York |
English |
Senior Technical Specialist- 3DIC Multiphysics and Advanced IC Packaging
Altair