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Altair® SimLab® for 3D IC Multiphysics

Live Webinar - May 8, 2025

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Enhanced Chip and 3D IC Reliability

Altair's electronic system design (ESD) solution represents a shift in the design and optimization of integrated circuits (ICs) and heterogeneous packages, employing a singular, integrated process centered around a 3D digital twin that expands collaboration and accelerates design. This approach is pivotal in solving complex systems' interrelated power and thermal challenges.

Join our webinar where industry expert, Iyad Rayane, will unveil Altair® SimLab®, a process-oriented multidisciplinary simulation environment used to analyze the performance of complex chip and 3D IC designs.

Additionally, SimLab improves the reliability of 3D IC designs and packages by ensuring resilience against warpage under compressive stresses, a common issue that can create significant reliability concerns in densely packed chiplet configurations. With SimLab’s proven, integrated approach, chip manufacturers can navigate the complexities of 3D IC design with greater confidence and precision – ultimately leading to more reliable and cost-effective electronic systems.

Global Time Zone Sessions:

Region Time Language Available
Asia 10:30 IST English
  13:00 China Chinese
  14:00 Seoul Korean
  14:00 Tokyo Japanese
Europe 16:00 Paris

English

Americas 10:00 New York

English

Chip designers learn how to identify and correct potential design issues earlier in development

Why should you attend?

  • Discover how a 3D digital twin approach revolutionizes IC and chiplet design: SimLab enables faster, more collaborative workflows that address power and thermal challenges early in the development process.
  • Understand how to enhance design reliability:  SimLab helps to mitigate warpage and stress-related failures, helping manufacturers build more robust and cost-effective 3D IC systems.

Speakers

IyadRayane_headshot

Iyad Rayane

Senior Technical Specialist- 3DIC Multiphysics and Advanced IC Packaging

Altair

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